Surface tension, adhesion and wetting of materials for photolithographic process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 4, 1996, Pages 2485-2492

  Bauer, J ^a  

^a IHP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM COPPER ALLOYS; ANGLE MEASUREMENT; AROMATIC COMPOUNDS; CONTACT ANGLE; OPTIMIZATION; PHOTOLITHOGRAPHY; PHOTORESISTS; SEMICONDUCTOR MATERIALS; SURFACE TREATMENT; WETTING;

FILM THICKNESS; HEXAMETHYLDISILAZANE; PRIMERS; SURFACE MODIFICATION; TRIMETHYLSILYDIETHYLAMINE;

SURFACE TENSION;

EID: 0030194145     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588757     Document Type: Article

References (23)

1. W. M. Moreau, Semiconductor Lithography (Plenum, New York, 1988).
2. R. Dammel, Diazonaphthoquinone-based Resist (SPIE Optical Engineering, Bellingham, WA, 1993), Vol. TT 11.
3. Michielsen, V. B. Marriott, J. J. Ponjee, H. van der Wel, F. J. Touwslager, and J. A. H. M. Moonen, Microlectron. 11, 475 (1990).
4. H. Yanazawa, Colloids Surf. 9, 133 (1984).
5. F. W. Fowkes, in Chemistry and Physics of Interfaces (American Chemical Society, Washington, DC, 1971), pp. 153-167.
6. F. W. Fowkes, Ind. Eng. Chem. 56, 12-40 (1964).
7. F. W. Fowkes, in Wetting (Society of Chemical Industry, London, 1967).
8. F. W. Fowkes, J. Phys. Chem. 66, 382 (1962);
9. F. W. Fowkes, J. Phys. Chem. 67, 2538 (1963).
10. J. L. Gardon, J. Paint Technology 38, 43 (1966).
11. C. M. Hansen and A. Beerbower, in Kirk-Othmer's Encyclopedia of Chemical Technology, Suppl. 2nd ed. (Wiley, New York, 1971), pp. 889.
12. E. F. Meyer and R. E. Wagner, J. Phys. Chem. 70, 3162 (1966).
13. E. F. Meyer, T. A. Renner, and K. S. Stec, Phys. Chem. 75, 642 (1971).
14. S. Wu, Polymer Interface and Adhesion (Marcel Dekker, New York, 1982).
15. S. Wu, in Recent Advances in Adhesion, Proc. Am. Chem. Soc. Symp. (American Chemical Society, Washington, DC, 1971), pp. 45-64.
16. N. Hackmann and A. C. Hall, J. Phys. Chem. 62, 12 (1958).
17. a.
18. E. Fadda, G. R. Amblard, A. P. Weill, and A. Prola, Advances in Resist Technology and Processing XI, Vol. 2195 (SPIE, Bellingham, WA, 1994), pp. 676-583.
19. J. F. Padday, Wetting, Spreading and Adhesion (Academic, New York, 1978).
20. E. G. Shafrin and W. A. Zisman, Am. Ceram. Soc. 50, 478 (1967).
21. W. A. Zisman, in Adhesion Science and Technology, edited by L. E. Lee (Plenum, New York, 1975), Vol. 9A, pp. 55-91.
22. D. D. Eley, Adhesion (Oxford University Press, Oxford, 1961).
23. Ch. A. Deckert and D. A. Peters, Thin Solid Films 68, 417 (1980).