The analysis of bending stress and mechanical property of ultralarge diameter silicon wafers at high temperatures

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 7, 1996, Pages 3799-3806

  Fukuda, Tetsuo ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Bending stress; Dislocation; Elastic theory; Releasing stress; Silicon; Slippage; Wafer

Indexed keywords

ANNEALING; BENDING (FORMING); COST EFFECTIVENESS; ELASTICITY; MECHANICAL PROPERTIES; SILICON; TEMPERATURE DISTRIBUTION;

BENDING STRESS; RELEASING STRESS; SILICON WAFERS;

DISKS (STRUCTURAL COMPONENTS);

EID: 0030192854     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.3799     Document Type: Article

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