The formation of Cu-Sn intermetallic compound and its effect on the fracture behavior of 80Sn-20Pb electrodeposits on Cu-based leadframe alloy

Surface and Coatings Technology

Volumn 82, Issue 1-2, 1996, Pages 23-28

  Kim, Jeong Han ^a   Suh, Min Suk ^a   Kwon, Hyuk Sang ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Additive; Cu Sn intermetallic compound; Fracture resistance; Pulse current; Sn Pb electrodeposits

Indexed keywords

COPPER ALLOYS; COPPER COMPOUNDS; ELECTRODEPOSITION; FRACTURE TOUGHNESS; INTERMETALLICS; LEAD COMPOUNDS; TIN COMPOUNDS;

ELECTRODEPOSITS;

COATINGS;

EID: 0030190965     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/0257-8972(95)02638-X     Document Type: Article

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