Computer simulation of process induced stress and strain development during cure of thick-section thermosetting composites

Computational Materials Science

Volumn 6, Issue 1, 1996, Pages 71-76

  Teplinsky, Sh ^a   Gutman, E M ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURING; GEOMETRY; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; REACTION KINETICS; STRAIN; STRESSES; TEMPERATURE DISTRIBUTION; THERMOSETS;

AUTOCLAVE CURING PROCESS; GLASS REINFORCED PHENOL MATRIX COMPOSITE; PROCESS INDUCED STRESS AND STRAIN DEVELOPMENT;

NONMETALLIC MATRIX COMPOSITES;

EID: 0030189779     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/0927-0256(96)00035-3     Document Type: Article

References (8)

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5. E.A. Turi, Thermal Characterization of Polymeric Materials (Academic Press, London, 1981) p. 441.
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