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Volumn 7, Issue 5, 1996, Pages 473-486
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Sputtering Rates and Nanoscale Cluster Production in a Hollow-Cathode Apparatus
a a a b c d |
Author keywords
[No Author keywords available]
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Indexed keywords
AGGLOMERATION;
DEPOSITION;
ELECTRIC CURRENTS;
METALS;
PLASMA APPLICATIONS;
PRESSURE EFFECTS;
SPUTTERING;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION;
CATHODE GEOMETRY;
FLOW VELOCITY;
GAS AGGREGATION TECHNIQUE;
HOLLOW CATHODE PLASMA SPUTTER DEVICE;
NANOCLUSTER PRODUCTION;
NANOSCALE METAL CLUSTERS;
SPUTTER SOURCE DISCHARGE CURRENT;
SPUTTERING RATES;
NANOSTRUCTURED MATERIALS;
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EID: 0030189471
PISSN: 09659773
EISSN: None
Source Type: Journal
DOI: 10.1016/0965-9773(96)00029-3 Document Type: Article |
Times cited : (10)
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References (22)
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