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Volumn 19, Issue 8, 1996, Pages
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Ultrafine pitch gold ball bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
AUTOMATION;
INTEGRATED CIRCUIT MANUFACTURE;
THRESHOLD ELEMENTS;
ACCURACY;
FINE PITCH LIMITATIONS;
FREE AIR BALL FORMATION;
GOLD BALL BONDERS;
REPEATABILITY;
BONDING;
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EID: 0030188789
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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