Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement

International Journal of Heat and Mass Transfer

Volumn 39, Issue 9, 1996, Pages 1883-1897

  Pitchumani, R ^a   Ranganathan, S ^b,d   Don, R C ^b   Gillespie Jr , J W ^b   Lamontia, M A ^c  

^a UNIVERSITY OF CONNECTICUT   (United States)

^b UNIVERSITY OF DELAWARE   (United States)

^c DUPONT COMPANY   (United States)

^d NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DEGRADATION; FIBER REINFORCED PLASTICS; HEAT TRANSFER; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); LAMINATED COMPOSITES; MATHEMATICAL MODELS; POLYETHER ETHER KETONES; SIMULATORS;

AUTOHESION; INTERFACIAL BONDING; INTIMATE CONTACT; POLYMER DEGRADATION; THERMOPLASTIC TOW PLACEMENT; VOID DYNAMICS; VOID GROWTH;

THERMOFORMING;

EID: 0030174451     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/0017-9310(95)00271-5     Document Type: Article

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