Pulsed electrodeposition of nickel

Plating and Surface Finishing

Volumn 83, Issue 6, 1996, Pages 62-66

  Devaraj, C ^a,b,c,d   Seshadri, S K ^d,e,f  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

^b UNIVERSITY OF MADRAS   (India)

^c INDIAN INSTITUTE OF TECHNOLOGY KANPUR   (India)

^d INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

^e UNIVERSITY OF PUNE   (India)

^f IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROLYSIS; FREQUENCIES; HARDNESS; NICKEL; NICKEL PLATING; POROSITY;

CATHODE POTENTIAL; CURRENT EFFICIENCY; DIRECT CURRENT EXPERIMENTS; HULL CELL EXPERIMENTS; PULSED CURRENT; PULSED ELECTRODEPOSITION; PULSED ELECTROLYSIS;

ELECTRODEPOSITION;

EID: 0030172288     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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