-
1
-
-
0026103850
-
Crown-shaped stackcd-capaeitor cell for 1.5-V operation 64-Mb DRAM's
-
T. Kaga. T. Kure, H. Shinriki, Y. Kawamoto, F. Murai, Y. Mshida, Y. Nakagomc, D. Hisamoto, T. Kisu, and K. Itoh, Crown-shaped stackcd-capaeitor cell for 1.5-V operation 64-Mb DRAM's. IEEE Trans. Electron Devices, vol. 38, no. 2, pp. 255-260. 1991.
-
(1991)
IEEE Trans. Electron Devices
, vol.38
, Issue.2
, pp. 255-260
-
-
Kaga T Kure, T.1
Shinriki, H.2
Kawamoto, Y.3
Murai, F.4
Mshida, Y.5
Nakagomc, Y.6
Hisamoto, D.7
Kisu, T.8
Itoh, K.9
-
2
-
-
0027848475
-
Ultra-thin TiN/Ta-4Os/W capacitor technology for 1 Obit DRAM
-
S. Kamiyama, H. Suzuki, H. Watanabe, A. Sakai, M. Oshida, T. Tatsumi. T. Tanigawa, N. Kakai, and A.Ishilani, Ultra-thin TiN/Ta-4Os/W capacitor technology for 1 Obit DRAM, IEDM Tech. Dig., pp. 49-52, 1993.
-
(1993)
IEDM Tech. Dig.
, pp. 49-52
-
-
Kamiyama, S.1
Suzuki, H.2
Watanabe, H.3
Sakai, A.4
Oshida, M.5
Tatsumi, T.6
Tanigawa, T.7
Kakai, N.8
-
3
-
-
0017006618
-
Chemical vapor deposition of tantalum pentoxide films for metal-insulatorsemiconductor devices
-
E. Kaplan, M. Balog, and D. Frohman-Bentchkowsky, Chemical vapor deposition of tantalum pentoxide films for metal-insulatorsemiconductor devices, J. Electrochem. Soc., vol. 123, no. 10, pp. 1570-1573. 1976.
-
(1976)
J. Electrochem. Soc.
, vol.123
, Issue.10
, pp. 1570-1573
-
-
Kaplan, E.1
Balog, M.2
Frohman-Bentchkowsky, D.3
-
4
-
-
0000508487
-
Effect of ozone annealing on the dielectric properties of tantalum oxide thin films grown by chemical vapor deposition
-
|4] C. Isohe and M. Saitoh, Effect of ozone annealing on the dielectric properties of tantalum oxide thin films grown by chemical vapor deposition, Appl. Phys. Lett., vol. 56, no. 10, pp. 907-909. 1990.
-
(1990)
Appl. Phys. Lett.
, vol.56
, Issue.10
, pp. 907-909
-
-
Isohe, C.1
Saitoh, M.2
-
5
-
-
0026122756
-
TJV-Oa and dry-Oo: Two step annealed chemical vapor-deposited Ta2Oo films for storage dielectrics of 64-Mb DRAM's
-
H. Shinriki and M. Nakata, TJV-Oa and dry-Oo: Two step annealed chemical vapor-deposited Ta2Oo films for storage dielectrics of 64-Mb DRAM's, IEEE Trans. Electron Devices, vol. 38, no. 3, pp. 455-461, 1991.
-
(1991)
IEEE Trans. Electron Devices
, vol.38
, Issue.3
, pp. 455-461
-
-
Shinriki, H.1
Nakata, M.2
-
6
-
-
0024000206
-
Photoprocess of tantalum oxide films and their characteristics
-
M. Matsui, S. Oka, K. Yamagistii. K. Kuroiwa and Y. Tarui, Photoprocess of tantalum oxide films and their characteristics, Jpn. J. Appl. Phys., vol. 27, no. 4. pp. 506-511, 1988.
-
(1988)
Jpn. J. Appl. Phys.
, vol.27
, Issue.4
, pp. 506-511
-
-
Matsui, M.1
Oka, S.2
Yamagistii, K.3
Kuroiwa, K.4
Tarui, Y.5
-
7
-
-
0024478599
-
Leakage-current reduction inhin Ta2Oo films for high-density VLSI memories
-
C. Hashimoto, H. Oikawa and N. Honma, Leakage-current reduction inhin Ta2Oo films for high-density VLSI memories, IEEE Trans. Electron Devices, vol. 36, no. 1, pp. 14-18, 1989.
-
(1989)
IEEE Trans. Electron Devices
, vol.36
, Issue.1
, pp. 14-18
-
-
Hashimoto, C.1
Oikawa, H.2
Honma, N.3
-
8
-
-
84954191552
-
Highly reliable 2.5 nm Ta2Or, capacitor process for 256-Mbit URAM's
-
[81 S. Kamiyama, T. Saeki, H. Mori, and Y. Numasawa, Highly reliable 2.5 nm Ta2Or, capacitor process for 256-Mbit URAM's, IEDM Tech. Dig., pp. 827-830, 1991.
-
(1991)
IEDM Tech. Dig.
, pp. 827-830
-
-
Kamiyama, S.1
Saeki, T.2
Mori, H.3
Numasawa, Y.4
-
9
-
-
0026992461
-
Effect of post-deposition annealing and electrode materials on the characteristics of tantalum oxide films deposited by plasma-enhanced chemical vapor deposition
-
H.'S. Park, Y. K. Back, J. C. Kirn, S. H. Choi, and K.H. Oh, Effect of post-deposition annealing and electrode materials on the characteristics of tantalum oxide films deposited by plasma-enhanced chemical vapor deposition, in Ext. Abst. 1992 Conf. Solid State Dev. Mater., 1992, pp. 524-526.
-
(1992)
Ext. Abst. 1992 Conf. Solid State Dev. Mater.
, pp. 524-526
-
-
Park, H.'.1
Back, Y.K.2
Kirn, J.C.3
Choi, S.H.4
Oh, K.H.5
-
10
-
-
0023562724
-
A high quality, high temperature compatible tantalum oxide film for advanced DRAM applications
-
B. W. Shih, I.-C. Chen, S. Banerjee, G. A. Brown, J. Bohlman, P.-H. Chang, and R. R. Doering, A high quality, high temperature compatible tantalum oxide film for advanced DRAM applications, IEDM Tech. Dig., pp. 582-585, 1987.
-
(1987)
IEDM Tech. Dig.
, pp. 582-585
-
-
Shih, B.W.1
Chen, I.-C.2
Banerjee, S.3
Brown, G.A.4
Bohlman, J.5
Chang, P.-H.6
Doering, R.R.7
-
11
-
-
3643139046
-
Optimum electrode materials for Ta-4Oj capacitors at high and low temperature processes
-
H. Matsuhashi and S. Nishikawa. Optimum electrode materials for Ta-4Oj capacitors at high and low temperature processes, in Ext. Abst. 1993 Conf. Solid Stale Dev. Mater., 1993, pp. 853-855.
-
(1993)
Ext. Abst. 1993 Conf. Solid Stale Dev. Mater.
, pp. 853-855
-
-
Matsuhashi, H.1
Nishikawa, S.2
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