Influence of residual stress on fracture toughness of silicon carbide whisker reinforced alumina

Journal of Materials Science Letters

Volumn 15, Issue 11, 1996, Pages 931-932

  Barinov, S M ^a   Grigorjev, O N ^b   Krivoshej, G J ^b   Shevchenko, A S ^b  

^a RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

^b FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CRYSTAL MICROSTRUCTURE; CRYSTAL WHISKERS; ELASTIC MODULI; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HOT PRESSING; INTERFACES (MATERIALS); RESIDUAL STRESSES; SILICON CARBIDE; THERMAL EXPANSION; X RAY CRYSTALLOGRAPHY;

COMPRESSIVE STRESS; HOOKES LAW; HOT PRESSING TEMPERATURE; MATRIX GRAIN SIZE; MEAN PARTICLE SIZE; RESIDUAL STRESS LEVEL; SILICON CARBIDE WHISKER REINFORCED ALUMINA; TOUGHENING EFFECTS; WHISKER PULL OUT PROCESS; X RAY MEASUREMENTS;

CERAMIC MATRIX COMPOSITES;

EID: 0030168683     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00241429     Document Type: Article

References (6)

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