Reliability of low cost copper heat spreader pin grid array ceramic packages

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 2, 1996, Pages 138-145

  Villani, Angelo ^a   Hsu, Shih C ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BRAZING; CERAMIC MATERIALS; COMPUTER SIMULATION; COPPER; ELASTIC MODULI; FAILURE ANALYSIS; FINITE ELEMENT METHOD; RELIABILITY; THERMAL EXPANSION; WEIBULL DISTRIBUTION; YIELD STRESS;

COPPER HEAT SPREADER; DATA INTERPRETATION; IN HOUSE STRESS INTERRELIABILITY CODE; PACKAGE SPREADER MATERIALS; PACKAGE TO MODULE ASSEMBLY; PIN GRID ARRAY CERAMIC PACKAGES; RELIABILITY ANALYSIS; THICKNESS; VIRTUAL DESIGN OF EXPERIMENTS; WARPAGE;

ELECTRONICS PACKAGING;

EID: 0030166473     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)