|
Volumn 19, Issue 6, 1996, Pages
|
Polymer developed to be interlayer dielectric
a a a |
Author keywords
[No Author keywords available]
|
Indexed keywords
COMPOSITION;
CURING;
DEPOSITION;
ELECTRIC PROPERTIES;
MULTILAYERS;
ORGANIC POLYMERS;
PERMITTIVITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
THERMAL STRESS;
THICKNESS CONTROL;
VACUUM APPLICATIONS;
CONFORMAL FILM;
INTERLAYER DIELECTRIC;
POLYMER RESEARCH;
TEMPERATURE STRESS;
VACUUM DEPOSITION;
WAFER PROCESSING;
DIELECTRIC MATERIALS;
|
EID: 0030165369
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
|
References (0)
|