Stress analysis of printed circuit boards with highly populated solder joints and components: A micromechanics approach

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 87-93

  Hu, K X ^a   Huang, Y ^b   Yeh, C P ^a   Wyatt, K W ^a  

^a MOTOROLA INC   (United States)

^b Michigan Technological University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPOSITE MICROMECHANICS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NUMERICAL METHODS; SOLDERED JOINTS; STRESS CONCENTRATION;

BACK SUBSTITUTION; ENERGY BALANCE; THREE PHASE COMPOSITE MODEL;

PRINTED CIRCUIT BOARDS;

EID: 0030165107     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792137     Document Type: Article

References (19)

1. Baker D. B., and Dasgupta A., 1993, “Thermal Stress Issues in Plated-Through-Hole Reliability,” Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau, ed., pp. 648-683, Van Nostrand Reinhold, New York.
2. Bao G., Hutchinson, J. W., and McMeeking R. M., 1991, “The Flow Stress of Dual-Phase, Non-Hardening Solids,” Mech. Materials, Vol. 12, pp. 85-94.
3. Benveniste Y., 1987, “A New Approach to the Application of Mori-Tanaka’s Theory in Composite Materials,” Mech. Materials, Vol. 6, pp. 147-157.
4. Budiansky B., 1965, “On the Elastic Moduli of Some Heterogeneous Material,” J. Mech. Phys. Solids, Vol. 13, pp. 223-227.
5. Chandra A., Huang, Y., Wei X., and Hu, K. X., 1995, “A Hybrid Micro-Macro BEM Formulation for Micro-Crack Clusters in Elastic Components,” Int. J. Num. Methods Engng., Vol. 38, pp. 1215-1236.
6. Christensen R., and Lo, K. H., 1979, “Solutions for Effective Shear Properties in Three Phase Sphere and Cylinder Models,” J. Mech. Phys. Solids, Vol. 27, pp. 315-330.
7. Engel, P. A., and Lim, C. K., 1988, “Stress Analysis in Electronics Packaging,” Finite Elements in Analysis and Design, Vol. 4, pp. 9-18.
8. Engel, P. A., 1990, “Structural Analysis for Circuit Card Systems Subject to Bending,” ASME Journal of Electronic Packaging, Vol. 112, pp. 2-10.
9. Hu, K. X., and Chandra, A., 1993, “Interactions among general systems of cracks and anticracks: an integral equation approach,” ASME Journal Applied Mechanics, Vol. 60, pp. 920-928.
10. Hu, K. X., Chandra, A., and Y. Huang, 1993a, “Multiple Void-Crack Interaction,” Int. J. Solids Struct., Vol. 30, pp. 1473-1489.
11. Hu, K. X., Chandra, A. and Y. Huang, 1993b, “Fundamental solutions for dilute distributions of inclusions embedded in microcracked solids,” Mechanics Mater., Vol. 16, pp. 281-294.
12. Hu, K. X., Chandra, A., and Y. Huang, 1994, “On Crack, Rigid-Line Fiber and Interface Interactions,” Mechanics Mater., Vol. 19, pp. 15-28.
13. Huang, Y., Hu, K. X., Wei X., and Chandra, A., 1994, “A Generalized Self-Consistent Mechanics Method for Composite Materials with Multiphase Inclusions,” J. Mech. Phys. Solids, Vol. 42, pp. 491-504.
14. Huang, Y., Hu, K. X., 1995, “A Generalized Self-Consistent Mechanics Method for Solids Containing Elliptical Inclusions,” ASME Journal Applied Mechanics, Vol. 62, pp. 566-572.
15. Hutchinson, J. W., 1977, “Bounds and Self-consistent Estimates for Creep of Polycrystalline Materials,” Proc. R. Soc., Series A 348, pp. 101-123.
16. Pitarresi J. M., Caletka, D. V., C Caldwell, and Smith D. E., 1991, “The Smeared Property Technique for the FE Vibration Analysis of Printed Circuit Cards,” ASME Journal of Electronic Packaging, Vol. 113, pp. 250-257.
17. Taya, M., Chou, T.-W., 1981, “On Two Kinds of Ellipsoidal Inhomogeneities in an Infinite Elastic Body: An Application to a Hybrid Composite,” Int. J. Solids Struc., Vol. 17, pp. 553-563.
18. Weng G. J., 1984, “Some Elastic Properties of Reinforced Solids with Special Reference to Isotropic Containing Spherical Inclusions,” Int. J. Eng. Sci., Vol. 22, pp. 845-856.
19. Weng G. J., 1990, “The Theoretical Connection Between Mori-Tanaka’s Theory and the Hashin-Shtrikman-Walpole Bounds,” Int. J. Eng. Sci., Vol. 28, pp. 1111-1120.