Electrochemically reduced polycrystalline tin oxide thin films: Surface analysis and electroplated copper adhesion

Journal of the Electrochemical Society

Volumn 143, Issue 6, 1996, Pages 2048-2052

  Feng, H ^a,b   Laverty, S J ^a   Maguire, P ^a   Molloy, J ^a   Meenan, B J ^a  

^a UNIVERSITY OF ULSTER   (United Kingdom)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; ELECTROCHEMISTRY; ELECTROPLATING; ETCHING; MORPHOLOGY; POLYCRYSTALLINE MATERIALS; SURFACE ROUGHNESS; SURFACES; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

SURFACE MODIFICATION; SURFACE SHEET RESISTANCE MEASUREMENTS; TIN OXIDE; X RAY REFLECTION;

THIN FILMS;

EID: 0030164481     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836947     Document Type: Article

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