The manufacture and use of panel products in the UK

Journal of the Institute of Wood Science

Volumn 14, Issue 1, 1996, Pages 21-26

  Irle, Mark ^a   Loxton, Ceri ^b  

^a Forest Products Research Centre

^b BANGOR UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPACTION; INDUSTRY; MANUFACTURE; STRUCTURAL PANELS;

CHIPBOARD; MEDIUM DENSITY FIBREBOARD; ORIENTED STRAND BOARD; UNITED KINGDOM; WOOD PANELS;

WOOD PRODUCTS;

EID: 0030156462     PISSN: 00203203     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Anon. (1996). The Forestry Industry Year-Book 1995. The Forestry Industry Council of Great Britain, London.
2. BS 1142. (1989). Fibre Building Boards. British Standards Institute, London.
3. BS 5669: Part 2. (1989) Particleboard: Specification for Wood Chipboard. British Standards Institute, London.
4. BS 5669: Part 3. (1992). Particleboard: Specification for Waferboard and Oriented Strand Board (OSB). British Standards Institute, London.
5. Dinwoodie,J.M. (1977). Causes of Deterioration of UF Chipboard Under Cyclic Humidity Conditions. I. Performance of UK Adhesive Films. Holzforschung 31(20):50-55.
6. Dinwoodie, J.M. (1978). The Properties and Performance of Particleboard Adhesives. Journal of Institute of Wood Science 8(2):59-68.
7. Irle, M.A. & Bolton, A.J. (1988). Physical Aspects of Wood Adhesive Bond Formation with Formaldehyde Based Adhesives. Part II. Binder Physical Properties and Particleboard Durability. Holzforschung 42(1):53-58.
8. Irle, M.A. & Bolton, A.J. (1991). Physical Aspects of Wood Adhesive Bond Formation with Formaldehyde Based Adhesives. Part III. The Creep Behaviour of Formaldehyde Based Resins at Different Relative Humidities. Holzforschung 45(1):69-73.
9. Maloney, T.M. (1993). Modern Particleboard & Dry-Process Fiberboard Manufacturing. Miller Freeman Inc., San Francisco.