-
1
-
-
3643102400
-
Electromigration in conductor stripes under pulsed dc powering
-
A. T. English, K. L. Tai. and P. A. Turner. "Electromigration in conductor stripes under pulsed dc powering," Appl. Phys. Lett., vol. 21, p. 397, 1972.
-
(1972)
Appl. Phys. Lett.
, vol.21
, pp. 397
-
-
English, A.T.1
Tai, K.L.2
Turner, P.A.3
-
2
-
-
0018812367
-
A model of electromigration failure under pulsed condition
-
J. M Sehnen, "A model of electromigration failure under pulsed condition," J. Appl. Phys., vol. 51, p.508, 1980.
-
(1980)
J. Appl. Phys.
, vol.51
, pp. 508
-
-
Sehnen, J.M.1
-
3
-
-
3643086836
-
On the electromigration failure under pulsed condition
-
R. E Hummel and H. H. Hoang, "On the electromigration failure under pulsed condition," J. Appl. Phys., vol. 65, 1929, 1989.
-
(1989)
J. Appl. Phys.
, vol.65
, pp. 1929
-
-
Hummel, R.E.1
Hoang, H.H.2
-
6
-
-
0024865572
-
Characterization of electromigration under bidirectional (be) and pulsed unidirectional (pdc) currenrt
-
J. A. Maiz, "Characterization of electromigration under bidirectional (be) and pulsed unidirectional (pdc) currenrt," in Proc. 27th Int. Reliability Phys. Symp., 1989, p. 230
-
(1989)
Proc. 27th Int. Reliability Phys. Symp.
, pp. 230
-
-
Maiz, J.A.1
-
7
-
-
0016473653
-
Electromigration in thin gold films on molybdenum surfaces
-
I. A. Blech and E. Kinsbron, "Electromigration in thin gold films on molybdenum surfaces," Thin Solid Films, vol. 25, p. 327, 1975.
-
(1975)
Thin Solid Films
, vol.25
, pp. 327
-
-
Blech, I.A.1
Kinsbron, E.2
-
8
-
-
0016940795
-
Electromigration in thin aluminum films on titanium nitride
-
I. A. Blech, "Electromigration in thin aluminum films on titanium nitride," J. Appl. Phys., vol. 47, p. 1203, 1976.
-
(1976)
J. Appl. Phys.
, vol.47
, pp. 1203
-
-
Blech, I.A.1
-
9
-
-
36749115512
-
Stress generation by eletromigration
-
I. A. Blech and C. Herring, "Stress generation by eletromigration," Appl. Phys. Lett., vol 29, p. 131, 1976.
-
(1976)
Appl. Phys. Lett.
, vol.29
, pp. 131
-
-
Blech, I.A.1
Herring, C.2
-
10
-
-
0022083990
-
Electromigration threshold in aluminum films
-
H. U. Schreiber, "Electromigration threshold in aluminum films," Solid State Electonics, vol. 28, p. 617, 1985.
-
(1985)
Solid State Electonics
, vol.28
, pp. 617
-
-
Schreiber, H.U.1
-
11
-
-
0015142191
-
Statistical metallurgical model for electromigration failure in aluminum thin-film conductous
-
M. J. Attardo, R. Rutledge, and R. C. Jack, "Statistical metallurgical model for electromigration failure in aluminum thin-film conductous," J. Appl. Phys., vol. 42, p. 4343, 1971.
-
(1971)
J. Appl. Phys.
, vol.42
, pp. 4343
-
-
Attardo, M.J.1
Rutledge, R.2
Jack, R.C.3
-
13
-
-
0025559990
-
Mechanism of ac electromigration
-
K Shono, T. Kuroki, H. Sekiya, and N. Yamada, "Mechanism of ac electromigration," in Proc. 7th Int. IEEE VMIC, 1990, p. 99.
-
(1990)
Proc. 7th Int. IEEE VMIC
, pp. 99
-
-
Shono, K.1
Kuroki, T.2
Sekiya, H.3
Yamada, N.4
-
14
-
-
0000268479
-
Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress
-
J. J. Clement, "Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress," J. Appl. Phys, vol. 71, p. 4264, 1992.
-
(1992)
J. Appl. Phys
, vol.71
, pp. 4264
-
-
Clement, J.J.1
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