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Volumn 17, Issue 5, 1996, Pages 244-246

Pulsed-current duty cycle dependence of electromigration-induced stress generation in aluminum conductors

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; ELECTRIC CONDUCTORS; ELECTRIC RESISTANCE; ELECTRIC VARIABLES MEASUREMENT; INTEGRATED CIRCUITS; SCANNING ELECTRON MICROSCOPY; STRESSES;

EID: 0030151749     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.491843     Document Type: Article
Times cited : (12)

References (14)
  • 1
    • 3643102400 scopus 로고
    • Electromigration in conductor stripes under pulsed dc powering
    • A. T. English, K. L. Tai. and P. A. Turner. "Electromigration in conductor stripes under pulsed dc powering," Appl. Phys. Lett., vol. 21, p. 397, 1972.
    • (1972) Appl. Phys. Lett. , vol.21 , pp. 397
    • English, A.T.1    Tai, K.L.2    Turner, P.A.3
  • 2
    • 0018812367 scopus 로고
    • A model of electromigration failure under pulsed condition
    • J. M Sehnen, "A model of electromigration failure under pulsed condition," J. Appl. Phys., vol. 51, p.508, 1980.
    • (1980) J. Appl. Phys. , vol.51 , pp. 508
    • Sehnen, J.M.1
  • 3
    • 3643086836 scopus 로고
    • On the electromigration failure under pulsed condition
    • R. E Hummel and H. H. Hoang, "On the electromigration failure under pulsed condition," J. Appl. Phys., vol. 65, 1929, 1989.
    • (1989) J. Appl. Phys. , vol.65 , pp. 1929
    • Hummel, R.E.1    Hoang, H.H.2
  • 6
    • 0024865572 scopus 로고
    • Characterization of electromigration under bidirectional (be) and pulsed unidirectional (pdc) currenrt
    • J. A. Maiz, "Characterization of electromigration under bidirectional (be) and pulsed unidirectional (pdc) currenrt," in Proc. 27th Int. Reliability Phys. Symp., 1989, p. 230
    • (1989) Proc. 27th Int. Reliability Phys. Symp. , pp. 230
    • Maiz, J.A.1
  • 7
    • 0016473653 scopus 로고
    • Electromigration in thin gold films on molybdenum surfaces
    • I. A. Blech and E. Kinsbron, "Electromigration in thin gold films on molybdenum surfaces," Thin Solid Films, vol. 25, p. 327, 1975.
    • (1975) Thin Solid Films , vol.25 , pp. 327
    • Blech, I.A.1    Kinsbron, E.2
  • 8
    • 0016940795 scopus 로고
    • Electromigration in thin aluminum films on titanium nitride
    • I. A. Blech, "Electromigration in thin aluminum films on titanium nitride," J. Appl. Phys., vol. 47, p. 1203, 1976.
    • (1976) J. Appl. Phys. , vol.47 , pp. 1203
    • Blech, I.A.1
  • 9
    • 36749115512 scopus 로고
    • Stress generation by eletromigration
    • I. A. Blech and C. Herring, "Stress generation by eletromigration," Appl. Phys. Lett., vol 29, p. 131, 1976.
    • (1976) Appl. Phys. Lett. , vol.29 , pp. 131
    • Blech, I.A.1    Herring, C.2
  • 10
    • 0022083990 scopus 로고
    • Electromigration threshold in aluminum films
    • H. U. Schreiber, "Electromigration threshold in aluminum films," Solid State Electonics, vol. 28, p. 617, 1985.
    • (1985) Solid State Electonics , vol.28 , pp. 617
    • Schreiber, H.U.1
  • 11
    • 0015142191 scopus 로고
    • Statistical metallurgical model for electromigration failure in aluminum thin-film conductous
    • M. J. Attardo, R. Rutledge, and R. C. Jack, "Statistical metallurgical model for electromigration failure in aluminum thin-film conductous," J. Appl. Phys., vol. 42, p. 4343, 1971.
    • (1971) J. Appl. Phys. , vol.42 , pp. 4343
    • Attardo, M.J.1    Rutledge, R.2    Jack, R.C.3
  • 14
    • 0000268479 scopus 로고
    • Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress
    • J. J. Clement, "Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress," J. Appl. Phys, vol. 71, p. 4264, 1992.
    • (1992) J. Appl. Phys , vol.71 , pp. 4264
    • Clement, J.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.