Modification of epoxy resins with polysiloxane TPU for electronic encapsulation. II

Journal of Applied Polymer Science

Volumn 60, Issue 8, 1996, Pages 1097-1107

  Ho, Tsung Han ^a   Wang, Jenn Hwa ^b   Wang, Chun Shan ^b  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; ELECTRONICS PACKAGING; ENCAPSULATION; MECHANICAL PROPERTIES; MOLECULAR STRUCTURE; MOLECULAR WEIGHT; MORPHOLOGY; POLYURETHANES; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; THERMAL EXPANSION; VISCOELASTICITY;

CRESOL FORMALDEHYDE NOVOLAC EPOXY RESIN; FLEXURAL MODULUS; MICROCRACKING; OXAZOLIDONE; POLYSILOXANE THERMOPLASTIC POLYURETHANE; THERMAL SHOCK CYCLING TEST;

EPOXY RESINS;

EID: 0030150761     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19960523)60:8<1097::AID-APP3>3.0.CO;2-G     Document Type: Article

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