Relationship between growth rate and undercooling in Pt-added Y1Ba2Cu3O7-x

Journal of Materials Research

Volumn 11, Issue 5, 1996, Pages 1114-1119

  Endo, A ^a   Chauhan, H S ^a   Nakamura, Y ^a   Shiohara, Y ^a  

^a SUPERCONDUCTIVITY RESEARCH LABORATORY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ANISOTROPY; COOLING; CRYSTAL GROWTH; CRYSTALS; HIGH TEMPERATURE SUPERCONDUCTORS; INTERFACES (MATERIALS); PLATINUM; REACTION KINETICS; SAMARIUM; SOLIDIFICATION; YTTRIUM COMPOUNDS;

CONSTANT UNDERCOOLING METHOD; CONTINUAL COOLING SOLIDIFICATION METHOD; GROWTH RATE; INTERFACE KINETICS; INTERFACE TEMPERATURE; PLATINUM ADDED YTTRIUM BARIUM CUPRATE; TOP SEEDING MELT TEXTURE METHOD;

OXIDE SUPERCONDUCTORS;

EID: 0030150272     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0142     Document Type: Article

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