Effect of strontium modification on near-threshold fatigue crack growth in an Al-Si-Cu die cast alloy

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 27, Issue 5, 1996, Pages 1293-1302

  Schaefer, M ^a   Fournelle, R A ^b  

^a Briggs and Stratton Corporation   (United States)

^b MARQUETTE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; CHEMICAL MODIFICATION; CRACK PROPAGATION; EUTECTICS; FATIGUE OF MATERIALS; FATIGUE TESTING; FRACTURE; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SILICON; STRONTIUM;

ALUMINUM SILICON COPPER DIE CAST ALLOY; CRACK PATH; FATIGUE CRACK GROWTH TESTING; FRACTURE MODE; NEAR THRESHOLD FATIGUE CRACK GROWTH; STRONTIUM MODIFICATION;

ALUMINUM ALLOYS;

EID: 0030148747     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02649866     Document Type: Article

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