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Advanced Materials for Optics and Electronics

Volumn 6, Issue 3, 1996, Pages 135-146

Filament-activated chemical vapour deposition of nitride thin films

(3) Deshpande, Sadanand V a,c,d Dupuie, Jeffrey L a,b Gulari, Erdogan a

a UNIVERSITY OF MICHIGAN (United States)

b FORD MOTOR COMPANY (United States)

c INDIAN INSTITUTE OF TECHNOLOGY KANPUR (India)

d ILLINOIS INSTITUTE OF TECHNOLOGY (United States)

Author keywords

Aluminium nitride; Ammonia; CVD; High rate deposition; Hot filament chemical vapour deposition; Silicon nitride; Titanium nitride

Indexed keywords

AMMONIA; CHEMICAL VAPOR DEPOSITION; SILICON NITRIDE; TITANIUM NITRIDE; TUNGSTEN;

ALUMINUM NITRIDE; HOT FILAMENT ACTIVATED CHEMICAL VAPOR DEPOSITION;

THIN FILMS;

EID: 0030148214 PISSN: 10579257 EISSN: None Source Type: Journal
DOI: 10.1002/(sici)1099-0712(199605)6:3<135::aid-amo221>3.0.co;2-4 Document Type: Review

Times cited : (6)

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