Microstructural evolution of copper thick films observed by environmental scanning electron microscopy

Journal of the American Ceramic Society

Volumn 79, Issue 5, 1996, Pages 1303-1306

  Sample, David R ^a   Brown, Paul W ^a,b   Dougherty, Joseph P ^a,b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; GLASS; INK; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; THICK FILMS;

COPPER THICK FILMS; ENVIRONMENTAL SCANNING ELECTRON MICROSCOPY;

COPPER;

EID: 0030146704     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1996.tb08588.x     Document Type: Article

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