Monitoring of out-of-plane displacement of hot medium and mechanism of fused silver solder cracking estimated by quantitative acoustic emission source wave analysis

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 5 B, 1996, Pages 3109-3116

  Hayashi, Kentaro ^a   Suzuki, Hiroaki ^a   Takemoto, Mikio ^a  

^a AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Acoustic emission; Heat resistant AE sensor; Inversion processing; Laser ultrasonic; Viscoelastic wave

Indexed keywords

ACOUSTIC EMISSIONS; CRACK PROPAGATION; DEGRADATION; ELASTIC WAVES; HEAT RESISTANCE; KINETIC THEORY; LASER APPLICATIONS; SENSORS;

INVERSION PROCESSING; LASER ULTRASONIC; VISCOELASTIC WAVE;

FRACTURE MECHANICS;

EID: 0030143655     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.3109     Document Type: Article

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