The influence of microstructural scale on the combination of strength and electrical resistivity in copper based composites

Journal of the Mechanics and Physics of Solids

Volumn 44, Issue 5, 1996, Pages 737-739

  Wood, J T ^a   Griffin, A J ^b   Embury, J D ^a   Zhou, R ^b   Nastasi, M ^b   Veron, M ^a  

^a MCMASTER UNIVERSITY   (Canada)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; MAGNETS; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; MICROSTRUCTURE; PHYSICAL PROPERTIES; STRENGTH OF MATERIALS; WINDING; WIRE;

INTERFACE SCATTERING; LORENTZ FORCE; MAXIMUM PULSE DURATION; SCALING LAWS;

METALLIC MATRIX COMPOSITES;

EID: 0030141233     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-5096(96)00010-5     Document Type: Article

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