Study of plasma-surface interactions: Chemical dry etching and high-density plasma etching

Plasma Sources Science and Technology

Volumn 5, Issue 2, 1996, Pages 193-199

  Oehrlein, G S ^a   Matsuo, P J ^a   Doemling, M F ^a   Rueger, N R ^a   Kastenmeier, B E E ^a   Schaepkens, M ^a   Standaert, Th ^a   Beulens, J J ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; DRY ETCHING; PLASMA ETCHING; PLASMA INTERACTIONS; SILICA; SILICON WAFERS; SURFACE STRUCTURE; SURFACE TREATMENT;

ELLIPSOMETRY; FLUOROCARBON DISCHARGES; PLASMA SURFACE INTERACTIONS;

PLASMA SOURCES;

EID: 0030134326     PISSN: 09630252     EISSN: None     Source Type: Journal    
DOI: 10.1088/0963-0252/5/2/012     Document Type: Article

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