Abrasive behaviour of nickel and copper multilayer alloys

Journal of Materials Science Letters

Volumn 15, Issue 8, 1996, Pages 645-647

  Liang, Y N ^a   Li, S Z ^b   Li, S ^b   Zhang, T C ^b   Yang, S R ^c  

^a TSINGHUA UNIVERSITY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

^c LANZHOU INSTITUTE OF CHEMICAL PHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER ALLOYS; ELECTRODEPOSITION; ENERGY DISSIPATION; MATERIALS TESTING; METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; OPTICAL MICROSCOPY; PLASTIC DEFORMATION; WEAR OF MATERIALS; WEAR RESISTANCE;

ABRASION TEST; ABRASIVE ELEMENT SCRATCHING; ANTIWEAR MECHANISMS; MULTILAYER ALLOYS; SINGLE PENDULUM SCRATCH TESTER;

MULTILAYERS;

EID: 0030129819     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00264100     Document Type: Article

References (7)

1. R. F. BUNNSHAH, R. NIMMAGGADA, H. J. DOERR, B. A. MOCHVAN, N. I. GREHANUK and E. V. DABIZHA, Thin Solid Films 72 (1980) 261.
2. D. BARAL, J. B. KETTERSON and J. E. HILLIAM, J. Appl. Phys. 57 (1986) 1079.
3. A. W. RUFF and N. K. MYSHKIN, Tribol. 111 (1989) 156.
4. A. W. RUFF and Z. X. WANG, Wear 131 (1989) 259.
5. A. W. RUFF and D. S. LASHMORE, Wear ibid. 151 (1991) 245.
6. Y. N. LIANG, S. Z. LI and S. LI, Wear ibid. 177 (1994) 167.
7. O. VINGSBO and HOGMARK, Wear ibid. 100 (1984) 489.