Thermal conductivity of polypyromellitimide film with alumina filler particles from 4.2 to 300 K

Cryogenics

Volumn 36, Issue 4, 1996, Pages 283-290

  Rule, D L ^a,b   Smith, D R ^a   Sparks, L L ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Alumax Technical Center   (United States)

Author keywords

Alumina; Contact resistance; Kapton; Polypyromellitimide film; Thermal conductivity

Indexed keywords

ALUMINA; CURING; HEAT RESISTANCE; MULTILAYERS; PLASTIC FILMS; POWDER METALS; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT;

ALUMINA FILLER PARTICLES; POLYPYROMELLITIMIDE FILM; STEADY STATE PARALLEL PLATE APPARATUS; THERMAL CONTACT RESISTANCE;

POLYIMIDES;

EID: 0030129581     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/0011-2275(96)88788-1     Document Type: Article

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