Damage and fracture of a cross woven C/SiC composite subject to compression loading

Journal of Materials Science

Volumn 31, Issue 8, 1996, Pages 2065-2069

  Wang, Mingde ^a   Laird, C ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); CARBON; COMPACTION; COMPRESSIBILITY OF SOLIDS; CRACK INITIATION; FRACTURE; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; STRAIN; STRESSES;

BUNDLE SEPARATION; COMPRESSION LOADING; COMPRESSION MODULUS; COMPRESSION STRESS STRAIN CURVE; KINKING; LINEAR ELASTIC DEFORMATION; PLY DELAMINATION; TRANSVERSE BUNDLE CRACKING;

CERAMIC MATRIX COMPOSITES;

EID: 0030129277     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00356628     Document Type: Article

References (8)

1. S. R. RICCITIELLO, W. L. LOVE and W. C. PITTS, SAMPE (July, 1993) 10.
2. J. LANKFORD, personal communication (1993).
3. J. LANKFORD, Idem, Comp. Sci. Tech., Personal communication.
4. J.-B. HA and J. A. NAIRN, SAMPE Q. (April, 1992) 29.
5. J. Y. ROSSIGNOL, J. M. QUENISSET, H. HANNACHE, C. MALLET, R. NASLAIN and F. CHRISTIN, J. Mater. Sci. 22 (1987) 3240.
6. Z. WANG, C. LAIRD, Z. HASHIN, B. W. ROSEN and C.-F. YEN, J. Mater. Sci. ibid. 26 (1991) 4751.
7. M. WANG and C. LAIRD, Acta Metall. Mater., in press.
8. M. WANG, PhD thesis, University of Pennsylvania, Philadelphia, USA (1994).