Removing particles from silicon wafer surfaces with adhesive tape

MICRO

Volumn 14, Issue 4, 1996, Pages 43-48

  Sugino, Rinji ^a,b,c   Mori, Haruhisa ^a,d,e  

^a FUJITSU LABORATORIES LTD   (Japan)

^b SUZUKA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^c JAPAN SOCIETY OF APPLIED PHYSICS   (Japan)

^d KYOTO UNIVERSITY   (Japan)

^e Kyoto University ^*

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; GAS CHROMATOGRAPHY; IMPURITIES; INTEGRATED CIRCUIT MANUFACTURE; MASS SPECTROMETRY; MATERIALS TESTING; PARTICLE SIZE ANALYSIS; PARTICLES (PARTICULATE MATTER); SILICON WAFERS; TAPES; ULTRAVIOLET RADIATION; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESIVE TAPE METHOD; INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRY; METAL CONTAMINANTS; PARTICLE REMOVAL;

SURFACE CLEANING;

EID: 0030128833     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. 2 Snow," Journal of Vacuum Science Technology, B9(4): 1970-1977, 1991.
2. Hoenig SA, "Cleaning Surfaces with Dry Ice," Compressed Air Magazine, 91(8):22-24, 1986.
3. McDermott WT, Ockovic RC, Wu JJ, et al., "Removing Submicron Surface Particles Using a Cryogenic Argon-Aerosol Technique," Microcontamination, 9(10):33-36, 94-95, 1991.
4. Ohmori T, Fukumoto T, Kato T, et al, "Ultra Clean Ice Scrubber Cleaning with Jetting Fine Ice Particles," in Proceedings of the First International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, Ruzyllo J, and Novak RE (eds), Pennington, NJ, The Electrochemical Society, vol 90-9, pp 182-191, 1989.
5. Chang PS, Brock JR, and Trachtenberg L, "Aerosol Jet Cleaning of Silicon Wafer Surfaces," in Surface Chemical Cleaning and Passivation for Semiconductor Processing, Higashi GS, Irene EA, and Ohmi T (eds), Pittsburgh, PA, Materials Research Society, vol 315, pp 249-255, 1993.