The reduction of CuO by Si during ball milling

Journal of Materials Science Letters

Volumn 15, Issue 7, 1996, Pages 634-635

  Xi, Shengqi ^a   Zhou, Jingen ^a   Wang, Xiaotian ^a   Zhang, Dongwen ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; CHEMICAL REACTIONS; FREE ENERGY; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; REDUCTION; SCANNING ELECTRON MICROSCOPY; SILICON; SYNTHESIS (CHEMICAL); X RAY DIFFRACTION;

COLLISION ENERGY; ELECTRON PROBE MICROANALYSIS; FREE ENERGY CHANGE; NANOMETRE COMPOSITE MATERIALS; RIGAKU X RAY POWDER DIFFRACTOMETER; X RAY EXAMINATION;

COPPER OXIDES;

EID: 0030128620     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf00579274     Document Type: Article

References (4)

1. J. S. BENJAMIN, Metall. Trans. 1 (1970) 2943.
2. C. C. KOCH et al., Appl. Phys. Lett. 43 (1983) 1017.
3. G. B. SCHAFFER and P. G. MCCORMICK, Materials Forum 16 (1992) 91.
4. A. GUINIER, "X-ray diffraction" (Freeman, San Fransico, 1963) p. 124.