Suppressing the formation of cone structures in chemical-vapor-deposited aluminum nitride/titanium nitride films

Journal of the American Ceramic Society

Volumn 79, Issue 4, 1996, Pages 1109-1112

  Liu, Yi Jun ^a   Kim, Hee Joon ^a,b   Takeuchi, Takashi ^a   Egashira, Yasuyuki ^a   Kimura, Hisamichi M ^a,c   Komiyama, Hiroshi ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ANALYTIC EQUIPMENT; CHEMICAL VAPOR DEPOSITION; CRYSTAL STRUCTURE; MICROANALYSIS; SCANNING ELECTRON MICROSCOPY; SILICON; SUBSTRATES; SURFACES; TITANIUM NITRIDE;

ALUMINUM NITRIDE; CONE STRUCTURES; ELECTRON PROBE X RAY MICROANALYZER;

METALLIC FILMS;

EID: 0030127946     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1996.tb08556.x     Document Type: Article

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