CMOS device and interconnect technology enhancements for low power/low voltage applications

Solid-State Electronics

Volumn 39, Issue 4 SPEC. ISS., 1996, Pages 481-488

  Vasudev, P K ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; METALLIZING; SILICON ON INSULATOR TECHNOLOGY; SUBSTRATES; THIN FILMS; ULSI CIRCUITS;

DRAM TECHNOLOGY; SIA ROADMAP;

CMOS INTEGRATED CIRCUITS;

EID: 0030127542     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/0038-1101(95)00164-6     Document Type: Article

References (18)

1. A. Chandrashekaran and R. Broderson, IEEE J. Solid St. Circuits 27, 473 (1992).
2. S. Mori and S. Taniguchi, IEDM Tech. Dig. (1992).
3. K. F. Lee and A. Owimazad, Extended Abstracts of the 1994 Solid State Devices and Materials. Yokohama, Japan (1994).
4. M. Yoshimi et al., IEEE ED-37, 2015 (1990).
5. K. Kato and T. Tsuchiya, IEEE ED-32, 458 (1985).
6. K. Kato and T. Tsuchiya, IEEE ED-33, 133 (1986).
7. M. Yoshimi et al., IEDM Tech. Dig. 429 (1994).
8. T. W. Sigmon. Private communication.
9. T. Mizuno et al., Dig. Tech. Papers, VLSI Symp. 13 (1994).
10. S. Roehl et al., Proc. 9th IEEE VLSI Multilevel Interconn. Conf. 22 (1992).
11. J. Paraszczak et al., IEDM Tech. Dig. 261 (1993).
12. Y. Shacham-Diamond, V. Dubin and M. Desilna Metallization Conf. Materials Research Soc., Austin, TX (1994).
13. Chiu Ting and B. Zhan, Materials Research Soc., Austin, TX (1994).
14. S. P. Jeng and R. Havemann, Dig. Tech. Papers, VLSI Symp. 73 (1994).
15. T. E. Seidel, P. K. Vasndev and T. Stanley, Electrochem. Soc. Symp. Abstracts. SF (1994).
16. P. K. Vasudev, M. Mendicino and T. E. Seidel, Solid-St. Electron.
17. L. Larson and J. Jensen IEDM Tech. Dig. (1989).
18. G. G. Shahidi, Extended Abstracts of 1994 Solid State Devices and Materials. Yokohama, Japan (1994).