The inter-relationship between grain boundary sliding and cavitation during creep of polycrystalline copper

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 27, Issue 4, 1996, Pages 901-907

  Ayensu, Akwasi ^a,b   Langdon, Terence G ^c  

^a UNIVERSITY OF CAPE COAST   (Ghana)

^b University of Southern California

^c UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; CREEP; CREEP TESTING; DATA ACQUISITION; GRAIN BOUNDARIES; IMAGE PROCESSING; MORPHOLOGY; PITTING; POLYCRYSTALLINE MATERIALS; STRAIN; STRESSES; TEMPERATURE;

CAVITY INTERLINKAGE; GRAIN BOUNDARY SLIDING; HIGH TEMPERATURE CREEP TEST; INHOMOGENEOUS CAVITY DEVELOPMENT; INTERNAL CAVITATION;

COPPER;

EID: 0030126606     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02649757     Document Type: Article

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