Ultrasonic evaluation of cement adhesion in wall tiles

Cement and Concrete Composites

Volumn 18, Issue 2, 1996, Pages 119-124

  Tan, K S ^a   Chan, K C ^a   Wong, B S ^a   Guan, L W ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BOND STRENGTH (MATERIALS); BONDING; CEMENTS; ELASTIC MODULI; MATERIALS TESTING; PERFORMANCE; TILE; ULTRASONIC MEASUREMENT; ULTRASONICS; WATER;

CEMENT ADHESION; SIGNAL AMPLITUDE; ULTRASONIC TESTING; WALL TILES; WATER CEMENT RATIO;

ADHESION;

EID: 0030124923     PISSN: 09589465     EISSN: None     Source Type: Journal    
DOI: 10.1016/0958-9465(95)00008-9     Document Type: Article

References (4)

1. Krautkramer, J. & Krautkramer, H., Ultrasonic testing of materials. Germany, Springer-Verlag, 1990 pp. 167-220.
2. Davis, W. R. and Brough, R., Ultrasonic techniques in ceramic research and testing., Ultrasonics, U.K., 10 (1972) 118-26.
3. Tan, K. S., Guan, L. W., Wong, B. S. & Chan, K. C., Non-destructive assessments of voids in tiled walls, Proceedings of International conference on building envelope systems and technology, Singapore (1994) 91-6.
4. Tan, K. S., Round, R. & Bridge, B., A feasibility study in monitoring the setting process of aluminiumortho-phosphate bonded ceramic using through transmission ultrasound, Br. Ceram. Tran. J., U.K., 88 (1989) 138-43.