Mechanical reliability of LiNbO3 optical modulators hermetically sealed in stainless steel packages

Optical Fiber Technology

Volumn 2, Issue 2, 1996, Pages 216-223

  Nagata, Hirotoshi ^a   Mitsugi, Naoki ^a  

^a SUMITOMO OSAKA CEMENT CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0030121956     PISSN: 10685200     EISSN: None     Source Type: Journal    
DOI: 10.1006/ofte.1996.0027     Document Type: Article

References (10)

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5. 3 substrate," Jpn. J. Appl. Phys., vol. 34, 606 (1995).
6. 3 optical intensity modulators," Opt. Engineering, vol. 34, 3284 (1995).
7. [7] N. Mitsugi, H. Nagata, M. Shiroishi, N. Miyamoto, and R. Kaizu, "Optical fiber breaks due to buckling: Problems in device packaging," Opt. Fiber Technol., vol. 1, 278 (1995).
8. 3 optical modulator devices," Opt. Fiber Technol., vol. 2, 98 (1996).
9. [9] H. Tadao, M. Matsuoka, and H. Nawafune, Eds, Mudenkai-Mekki (Electroless Plating), Chaps. 1-4, Nikkan Kogyo Shinbun-sha, Tokyo, 1994. [in Japanese].
10. [10] T. Takemoto and R. Satou, Koushinraisei-Maikurosorudaringu-Gijyutsu (Highly Reliable Micro-soldering Technology), Kogyo Chousa-Kai, Tokyo, 1991. [in Japanese]