Morphology and stability of electrochemically generated copper layers: The effect of electron transfer and nucleation kinetics

Circuit World

Volumn 22, Issue 3, 1996, Pages 4-9

  Wunsche M ^a   Meyer, H ^a   Schumacher, R ^a  

^a ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL ANALYSIS; CRYSTAL STRUCTURE; CURRENT DENSITY; DUCTILITY; ELECTROCHEMISTRY; ELECTROLYTES; ELECTRON TRANSPORT PROPERTIES; LIGHT REFLECTION; MORPHOLOGY; NUCLEATION; REACTION KINETICS;

COPPER ELECTROLYTE; COULOMETRY; MICROGRAVIMETRY; MICROSECTIONS; OPTICAL REFLECTION MEASUREMENT; PROCESS ELECTROLYTE; TOPOGRAPHICAL VIEWS;

COPPER;

EID: 0030114044     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129610800036     Document Type: Article

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