Striated morphology during electrodeposition

Journal of the Electrochemical Society

Volumn 143, Issue 3, 1996, Pages 865-873

  Jorné, Jacob ^a   Lee, Michael G ^a,b  

^a University of Rochester   (United States)

^b FUJITSU LABORATORIES OF AMERICA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; DIFFUSION; ELECTROLYTES; MORPHOLOGY; NUMERICAL ANALYSIS; POLARIZATION; SILVER; ZINC;

LAYER THICKNESS EFFECT; LINEAR STABILITY ANALYSIS; ROTATING ELECTRODES; SPATIAL MULTIPLICITY; STRIATION;

ELECTRODEPOSITION;

EID: 0030109815     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836550     Document Type: Article

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