Electroplated palladium coating as a nickel migration (Thermal) barrier

Plating and Surface Finishing

Volumn 83, Issue 3, 1996, Pages 64-67

  Lim, J K ^a   Russo, J S ^a,b   Antonier, E ^a,c,d  

^a RAYTHEON COMPANY   (United States)

^b PRATT INSTITUTE   (United States)

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^d PEPPERDINE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; MASS TRANSFER; MATERIALS TESTING; NICKEL; NICKEL COMPOUNDS; PALLADIUM; SEALING (FINISHING); SURFACE PROPERTIES;

HERMETIC SEALING CHARACTERISTICS; NICKEL COBALT; PALLADIUM COATING; SOLDERABILITY; THERMAL BARRIER;

ELECTROPLATING;

EID: 0030108974     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. H.K. Straschil, J.A. Abys et al., Metal Fin., 90, 42 (Jan., 1992).
2. E.J. Kudrak, J.A. Abys et al., Plat. and Surf. Fin., 79, 49 (Feb., 1992).
3. Charles Iacovangelo, Proc. AESF SUR/FIN '92, p. 511.
4. J.S. Russo, unpublished report, Hughes Aircraft Company, (Oct., 1989).
5. J.K. Lim, unpublished report, Hughes Aircraft Company (Sept., 1991).
6. J.S. Russo, Plat. and Surf. Fin., 81, 63 (July, 1994).
7. M.Hanson, Constitution of Binary Alloys, 2nd Ed., McGraw-Hill Book Co., New York, NY, 1958.