Statistical model for the inherent tilt of flip-chips

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 1, 1996, Pages 16-20

  Goldmann, Lewis S ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; MATHEMATICAL MODELS; MONTE CARLO METHODS; SOLDERING ALLOYS;

HIGH POWER ELECTRONIC APPLICATIONS; STATISTICAL VARIATION; VARIABILITY;

FLIP CHIP DEVICES;

EID: 0030108481     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792120     Document Type: Article

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