Roles of cap-metal on via electromigration resistance in aluminum-based interconnections

Journal of the Electrochemical Society

Volumn 143, Issue 3, 1996, Pages 1043-1049

  Yamaha, Takahisa ^a   Naito, Masaru ^a   Hotta, Tadahiko ^a  

^a YAMAHA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTROMIGRATION; FABRICATION; INTERFACES (MATERIALS); LSI CIRCUITS; METALLIZING; SUBSTRATES; TITANIUM NITRIDE; TUNGSTEN COMPOUNDS;

ALUMINUM BASED INTERCONNECTIONS; CAP METAL; TUNGSTEN SILICIDE; VIA CONTACTS;

ELECTRIC CONTACTS;

EID: 0030104992     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836579     Document Type: Article

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