Autocatalytic gold plating process for electronic packaging applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 41-44

  Gaudiello, John G ^a  

^a IBM   (United States)

Author keywords

Autocatalytic; Electroless gold; MCM; Plating; Wirebonding

Indexed keywords

CERAMIC MATERIALS; ELECTROLESS PLATING; ELECTRONICS PACKAGING; LAMINATES; MULTICHIP MODULES; SUBSTRATES;

AUTOCATALYTIC GOLD PLATING PROCESS; BATH LIFE; WIRE BONDING;

GOLD PLATING;

EID: 0030104461     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486560     Document Type: Article

References (10)

1. D. P. Seraphin, R. Lasky, and C. Y. Li, Principles of Electronic Packaging. New York: McGraw-Hill, 1989, ch. 16, pp. 470-518.
2. F. A. Lowenhein, Electroplating. New York: McGraw-Hill, 1980.
3. A. R. Denero, Elementary Electrochemistry, 2nd ed. London: Butterworth, 1971.
4. F. A. Lowenheim, Modern Electroplating. New York: Wiley, 1974.
5. F. Simon, "Deposition of gold without external current source," Gold Bull., vol. 26, no. 1, pp. 14, 1993.
6. H. O. Ali and I. R. A. Christie, "A review of electroless gold deposition processes," Gold Bull., vol. 17, no. 4, pp. 118, 1984.
7. Y. Okinaka, "Electroless gold deposition using borohydride or dimethylamine borane as reducing agent," Plat. Surf. Finish, vol. 57, pp. 914, 1970.
8. C. D. Iacovangelo, "Autocatalytic electroless gold deposition using hydrazine and dimethylamine borane as reducing agents," J. Electrochem. Soc., vol. 138, no. 4, p. 976, 1991.
9. M. U. Kittel and C. J. Raub, "The mixed potential in autocatalytic gold baths," Metalloberflaeche, vol. 42, no. 2, p. 75, 1988.
10. Military Specification MIL-G-45204C.