|
|
Volumn 62, Issue 595, 1996, Pages 1164-1171
|
|
Prediction algorithm of thermal resistance in the case of pin-fin heat sinks for LSI packages using impingement cooling
a
a
NONE
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ALGORITHMS;
COOLING;
ELECTRONICS PACKAGING;
FLOW VISUALIZATION;
HEAT CONVECTION;
HEAT RESISTANCE;
INTEGRATED CIRCUIT LAYOUT;
LSI CIRCUITS;
MATHEMATICAL MODELS;
IMPINGEMENT COOLING;
PIN FIN HEAT SINKS;
FINS (HEAT EXCHANGE);
|
|
EID: 0030102577
PISSN: 03875016
EISSN: None
Source Type: Journal
DOI: 10.1299/kikaib.62.1164 Document Type: Article |
|
Times cited : (8)
|
|
References (17)
|
