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Volumn 143, Issue 2, 1996, Pages 619-623
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Kinetics and modeling of wet etching of aluminum oxide by warm phosphoric acid
a a
a
UCB 450
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
DIELECTRIC FILMS;
ETCHING;
HYDROGEN;
IONS;
MATHEMATICAL MODELS;
OXIDES;
PHOSPHORIC ACID;
REACTION KINETICS;
SPUTTER DEPOSITION;
TEMPERATURE;
VACUUM APPLICATIONS;
CONSTANT ETCH RATE;
DEPOSITION BATCH;
ETCHANT CONCENTRATION;
FIRST ORDER KINETICS;
HYDROGEN ION CONCENTRATION;
WARM PHOSPHORIC ACID;
WET ETCHING;
ALUMINUM COMPOUNDS;
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EID: 0030086564
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1836489 Document Type: Article |
Times cited : (28)
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References (21)
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