The role of nickel and zinc in ETP copper

Wire Journal International

Volumn 29, Issue 2, 1996, Pages 92-102

  Pops, Horace ^a   Holloman, James ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPOSITION; COPPER; DISPERSION HARDENING; ELECTRIC CONDUCTIVITY; IMPURITIES; NICKEL; QUENCHING; SOLID SOLUTIONS; STRENGTH OF MATERIALS; SULFUR; ZINC;

ANNEALABILITY; CHEMICAL COMPOSITION; COPPER WIRES; ELECTROLYTIC TOUGH PITCH;

WIRE;

EID: 0030085940     PISSN: 02774275     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)

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