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Journal of Physics D: Applied Physics

Volumn 29, Issue 2, 1996, Pages 436-441

The laboratory simulation of thermal shock failure

(2) Pickles, C S J a Field, J E a

a UNIVERSITY OF CAMBRIDGE (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT RESISTANCE; MATERIALS TESTING APPARATUS; MECHANICAL PROPERTIES; SHOCK TESTING; SIMULATION; THERMAL EFFECTS; THERMAL STRESS; THERMODYNAMIC PROPERTIES;

LABORATORY SIMULATION; THERMAL EXPANSION STRESS; THERMAL SHOCK FAILURE; THERMAL SHOCK RESISTANCE; THERMAL SHOCK TEST APPARATUS;

FAILURE (MECHANICAL);

EID: 0030085306 PISSN: 00223727 EISSN: None Source Type: Journal
DOI: 10.1088/0022-3727/29/2/022 Document Type: Article

Times cited : (15)

References (12)

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2
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3
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4
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6
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9
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10
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11
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12
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