-
1
-
-
0000922910
-
0.47As formed by rapid thermal processing
-
0.47As formed by rapid thermal processing," J. Appl. Phys., vol. 67, pp. 3754-3760, 1990.
-
(1990)
J. Appl. Phys.
, vol.67
, pp. 3754-3760
-
-
Chu, S.N.G.1
Katz, A.2
Boone, T.3
Thomas, P.M.4
Riggs, V.G.5
Dautremont-Smith, W.C.6
Johnston, W.D.7
-
2
-
-
0026120927
-
AlInAs/GaInAs HBT IC Technology
-
J. F. Jensen, W. E. Stanchina, R. A. Metzger, D. B. Rensch, R. F. Lohr, R. W. Quen, M. W. Pierce, Y. K. Allen, and P. F. Lou, "AlInAs/GaInAs HBT IC Technology," IEEE J. Solid-State Cct., vol. 26, pp. 415-420, 1991.
-
(1991)
IEEE J. Solid-State Cct.
, vol.26
, pp. 415-420
-
-
Jensen, J.F.1
Stanchina, W.E.2
Metzger, R.A.3
Rensch, D.B.4
Lohr, R.F.5
Quen, R.W.6
Pierce, M.W.7
Allen, Y.K.8
Lou, P.F.9
-
3
-
-
0026897850
-
InAlAs/InGaAs heterojunction bipolar transistors with AlAs etch-stop layer
-
C. S. Kyono, S. C. Binari, W. Kruppa, K. Ikossi-Anastasiou, and H. S. Hier, "InAlAs/InGaAs heterojunction bipolar transistors with AlAs etch-stop layer," Electron Lett., vol. 28, pp. 1388-1390, 1992.
-
(1992)
Electron Lett.
, vol.28
, pp. 1388-1390
-
-
Kyono, C.S.1
Binari, S.C.2
Kruppa, W.3
Ikossi-Anastasiou, K.4
Hier, H.S.5
-
4
-
-
0000012558
-
0.47As low-resistance nonalloyed ohmic contact formed by rapid thermal processing
-
0.47As low-resistance nonalloyed ohmic contact formed by rapid thermal processing," Appl. Phys. Lett., vol. 54, pp. 2306-2308, 1989.
-
(1989)
Appl. Phys. Lett.
, vol.54
, pp. 2306-2308
-
-
Katt, A.1
Dautremont-Smith, W.C.2
Chu, S.N.G.3
Thomas, P.M.4
Koszi, L.A.5
Lee, J.W.6
Riggs, V.G.7
Brown, R.L.8
Napholtz, S.G.9
Zilko, J.L.10
Lahav, A.11
-
5
-
-
36549097409
-
0.47As and n-Inp layers formed by a single metallization common step and rapid thermal processing
-
0.47As and n-Inp layers formed by a single metallization common step and rapid thermal processing," J. Appl. Phys., vol. 63, pp. 1123-1128, 1990.
-
(1990)
J. Appl. Phys.
, vol.63
, pp. 1123-1128
-
-
Katz, A.1
Weir, B.E.2
Dautremont-Smith, W.C.3
-
6
-
-
0026142958
-
Electrical Characteristics and Reliability of Pt/ti/Pt/Au ohmic contacts to p-type GaAs
-
H. Okada, S.-I. Shikata, and H. Hayashi, "Electrical Characteristics and Reliability of Pt/ti/Pt/Au ohmic contacts to p-type GaAs," Japan J. Appl. Phys., vol. 30, pp. L558-L560, 1991.
-
(1991)
Japan J. Appl. Phys.
, vol.30
-
-
Okada, H.1
Shikata, S.-I.2
Hayashi, H.3
-
7
-
-
0001519744
-
A controllable mechanism of forming low-resistance nonalloyed ohmic contacts to group III-V compound semiconductors
-
G. Stareev, H. Künzel, and G. Dortmann, "A controllable mechanism of forming low-resistance nonalloyed ohmic contacts to group III-V compound semiconductors," J. Appl. Phys. vol. 74, pp. 7344-7356, 1993.
-
(1993)
J. Appl. Phys.
, vol.74
, pp. 7344-7356
-
-
Stareev, G.1
Künzel, H.2
Dortmann, G.3
-
8
-
-
0028464175
-
0.47As or GaAs-AlGaAs heterojunction bipolar transistor applications
-
0.47As or GaAs-AlGaAs heterojunction bipolar transistor applications," Mat. Sci. & Eng., vol. B25, pp. 175-178, 1994.
-
(1994)
Mat. Sci. & Eng.
, vol.B25
, pp. 175-178
-
-
Merkel, K.G.1
Bright, V.M.2
Schauer, S.N.3
-
9
-
-
0007327348
-
0.47As ohmic contacts formed by rapid thermal processing
-
0.47As ohmic contacts formed by rapid thermal processing," Appl. Phys. Lett., vol. 44, pp. 2220-2222, 1989.
-
(1989)
Appl. Phys. Lett.
, vol.44
, pp. 2220-2222
-
-
Katz, A.1
Weir, B.E.2
Maher, D.M.3
Thomas, P.M.4
Dautermont-Smith, M.C.5
Karlicek Jr., R.F.6
Wynn, J.D.7
Kimerling, L.C.8
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