Effect of thermodynamics on filled moisture cure hot melts

Adhesives Age

Volumn 39, Issue 2, 1996, Pages 30-33

  Oien, H T ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; MOLECULAR WEIGHT; PHASE TRANSITIONS; POLYESTERS; POLYURETHANES; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT; THERMODYNAMICS;

GLASS BUBBLES; HEAT OF CRYSTALLIZATION; MOISTURE CURED HOT MELTS; PEEL ADHESION; PREPOLYMERS;

HOT MELT ADHESIVES;

EID: 0030083298     PISSN: 0001821X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (5)

1. U.S. Patent Nos. 4,214,019 and 4,252,712 to Donnermeyer et al.
2. U.S. Patent No. 4,388,424 to Kennell et al.
3. U.S. Patent No. 4,005,033 to Geogeau et al.
4. P.C.T. Application No. 92/09503 to Garvey et al.
5. European Patent Application No. 0455400 to Stobbie et al.