Microstructure and thermal conduction properties of Al2O3-Ag composites

Acta Materialia

Volumn 44, Issue 2, 1996, Pages 813-818

  Liu, D M ^a   Tuan, W H ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM ALLOYS; ELECTRONS; HEAT RESISTANCE; METAL FOIL; METALLOGRAPHIC PHASES; MICROSTRUCTURE; PHONONS; SILVER; TEMPERATURE; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL DIFFUSION IN SOLIDS;

ALUMINA SILVER COMPOSITES; CAVITY FORMATION; COMPOSITE THEORY PREDICTION; INTERFACIAL CONTACT RESISTANCE; RESIDUAL PORE PHASE; THERMAL CYCLIC FLASH DIFFUSIVITY METHOD;

CERAMIC MATRIX COMPOSITES;

EID: 0030083241     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6454(95)00205-7     Document Type: Article

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