Joint design methodology based on the electromagnetic shielding effectiveness capabilities

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 238-247

  Mottahed, Behzad D ^a   Manoochehri, Souran ^b  

^a LUCENT TECHNOLOGIES   (United States)

^b Stevens Institute of Technology   (United States)

Author keywords

EMI EMC; Gap; Joint design; Shielding effectiveness; Slot; Tolerance

Indexed keywords

BOUNDARY CONDITIONS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC FIELD THEORY; ELECTROMAGNETIC FIELDS; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTROMAGNETIC WAVE TRANSMISSION; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD;

GAP TOLERANCES; IMPEDANCE BOUNDARY CONDITIONS; JOINT DESIGN METHODOLOGY; SHIELDING EFFECTIVENESS;

ELECTRONICS PACKAGING;

EID: 0030082994     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486508     Document Type: Article

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