Guidelines for high-performance electronic package interconnections - A simple approach

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 230-237

  Yang, Yaochao ^a,b   Brews, John R ^a,b  

^a IEEE

^b University of Arizona   (United States)

Author keywords

CMOS; Crosstalk; Electronic package interconnections; Transient response; Undershoot

Indexed keywords

ALGORITHMS; CAPACITANCE; CMOS INTEGRATED CIRCUITS; CROSSTALK; ELECTRIC LINES; ELECTRIC LOADS; ELECTRIC NETWORK SYNTHESIS; ELECTRIC WIRING; TRANSMISSION LINE THEORY;

ELECTRONIC PACKAGE INTERCONNECTIONS; LOOSELY COUPLED LINES; LOW LOSSLINES; PACKAGING DENSITY; SMALL CAPACITIVE LOADS; TRANSIENT RESPONSE; UNDERSHOOT REQUIREMENTS;

ELECTRONICS PACKAGING;

EID: 0030082027     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486507     Document Type: Review

References (13)

1. J. R. Brews, "Electrical modeling of interconnections," Submicron Integrated Circuits, R. K. Watts, Ed. New York: Wiley, 1989, pp. 269-331, ch. 6.
2. A. E. Ruehli and P. A. Brennan, "Capacitance models for integrated circuit metallization wires," IEEE J. Solid-State Circuits, vol. SC-10, no. 6, pp. 530-536, Dec. 1975.
3. J. R. Brews, "Overshoot-controlled RLC interconnections," IEEE Trans. Electron Devices, vol. 38, no. 1, pp. 76-87, Jan. 1991.
4. W. Mi and J. R. Brews, "Guidelines governing the need for low-impedance drivers for MCM's," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 16, no. 1, pp. 152-156, Feb. 1993.
5. Y. Yang and J. R. Brews, "Overshoot control for two coupled RLC interconnections," IEEE Trans. Comp., Packag., Manufact. Technol., Part B, vol. 17, no. 3, pp. 418-425, Aug. 1994.
6. J. A. DeFalco, "Reflection and crosstalk in logic circuit interconnections," IEEE Spectrum, pp. 44-50, July 1970.
7. H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990, p. 300, ch. 7.
8. Y. Yang and J. R. Brews, "Design guidelines for high-performance electronic interconnections - Approach for strong coupling," IEEE Trans. Comp. Pack. Manuf. Technol. Part B, to appear.
9. M. R. Scheinfein, "Method of moments TEM transmission line parameter calculator," User's Guide, University of Arizona, Tucson, AZ, 1986.
10. T. Sakurai and K. Tamaru, "Simple formulas for two- and three-dimensional capacitances," IEEE Trans. Electron Devices, vol. ED-30, no. 2, pp. 183-185, Feb. 1983.
11. E. T. Lewis, "An analysis of interconnect line capacitance and coupling for VLSI circuits," Solid-State Electronics, vol. 27, nos. 8/9, pp. 741-749, 1984.
12. K. C. Gupta, R. Garg, and R. Chadha, Computer-Aided Design of Microwave Circuits. Boston, MA: Artech House, 1981, pp. 47-88, ch. 3.
13. T. Edwards, Foundations for Microstrip Circuit Design. New York: Wiley, 1992, pp. 41-75, ch. 3.