|
Volumn 26, Issue 2, 1996, Pages 161-170
|
Bulk copper electrodeposition on gold imaged by in situ STM: Morphology and influence of tip potential
a a a a |
Author keywords
[No Author keywords available]
|
Indexed keywords
COPPER;
CURRENT VOLTAGE CHARACTERISTICS;
DISSOLUTION;
ELECTROCHEMICAL ELECTRODES;
ELECTROCHEMISTRY;
GOLD;
GROWTH (MATERIALS);
MORPHOLOGY;
NUCLEATION;
POLYCRYSTALLINE MATERIALS;
SCANNING TUNNELING MICROSCOPY;
BULK COPPER ELECTRODEPOSITION;
CATHODIC OVERPOTENTIALS;
COPPER GOLD ALLOY;
CURRENT VOLTAGE DIAGRAM;
ELECTROCHEMICAL MEASUREMENTS;
THREE DIMENSIONAL ISLANDS;
TIP POTENTIAL;
ELECTRODEPOSITION;
|
EID: 0030081194
PISSN: 0021891X
EISSN: None
Source Type: Journal
DOI: 10.1007/BF00364066 Document Type: Article |
Times cited : (32)
|
References (28)
|